A. High speed : High speed and large capacity, large size, high aspect ratio, high density backplane and system board, various back drilling processes, high speed simulation and testing capabilities, widely used in communication base stations, routers, switches, Network communication equipment such as service/storage
B. RF Microwave : Mixed-pressure and local-mixed voltage, high-precision RF line control, and various step-groove processes, widely used in communication base stations, microwave communication, and self-driving anti-collision radar
C. Thermal Management: metal-based and thick copper PCB, multi-functional integration, embedded power devices, ultra-thick copper processing technology, mainly used in communication base station amplifiers, power modules, power devices, new energy vehicles, etc
D. Miniaturization: One-stop miniaturization solution, high-density HDI and package substrate, SiP system-level packaging technology, multiple rigid-flexible structures, embedded active chips and passive devices, mainly used in industrial control, medical , aerospace and communications industries
SMT is an abbreviation of Surface Mounted Technology and is one of the most popular technologies and processes in the electronics assembly industry, also known as surface mount or surface mount technology.
SMT basic process components: Incoming material inspection -- silk screen solder paste (point patch adhesive) -- patch -- drying (curing ) -- reflow soldering -- cleaning -- inspection -- rework
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