| Technical Capability(PCB/FPC/RFPC) | |||
| Items | Mass | Sample | |
| layers | 2-68L | 2-120L | |
| Max. Board Thickness | 10mm（394mil） | 14mm（551mil） | |
| Min. Width/Space | Inner Layer | 50/50um | 40/40um |
| out layer | 65/65um | 50/50um | |
| Registration | Same Core | ±25um | ±20um |
| Layer to Layer | ±4.5mil | ±4mil | |
| Heavy Copper | 6oz | 30oz | |
| Min. Drill Hole Diameter | Mechanical | ≥0.15mm(6mil) | ≥0.1mm(4mil) |
| Laser | 0.1-0.35mm | 0.05-0.35mm | |
| Max. Size (Finish Size) | Line-card | 850mmX570mm | 1000mmX570mm |
| Backplane | 1250mmX570mm | 1320mmX570mm | |
| Aspect Ratio (Finish Hole) | Line-card | 20:1 | 27:1 |
| Backplane | 25:1 | 32:1 | |
| Raw Material | Lead free/Halogon free | EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W,EM285,TU862HF,EM370D,IT170GRA1, Autolad1,Autolad3,NP175FBH,IT170GT,H175HF | |
| High Speed | Megtron4, TU872SLK, FR408HR,N4000-13Series, S7439C,TU863+,Megtron6, MW2000, IT968,EM891,Megtron7,MW4000,TU933,DS7409DVN,IT988GSE | ||
| High Frequency | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27,TLY series，AD series，RT6002 | ||
| Others | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000,ST115 | ||
| Surface Finish | HASL,ENIG,Immersion Tin,OSP,Immersion Silver,Gold finger,Electroplating Hard Gold/Soft Gold,Selective OSP, ENEPIG | ||
| Gold fingers(gold thickness) | 40U" | 60U" | |
| Radio Frequency/Micro Strip Precision | Line Width | ±0.8mil/±0.5mil | ±0.6mil/±0.5mil |
| Line Length | ±1.5mil/±1.2mil | ±1.2mil/±1mil | |
| Heat-sink | Structure | Post-bonding, Pre-bonding, Sweat-soldering, Conductive adhesive, Press-fit,Embedded Coin(I, T U) | |
| HDI | Structure | Max Layer count( any layer)18L | Max Layer count( any layer)18L/20L |
| Min Blind via size (mm) | 0.1mm/0.075mm | 0.075mm/0.075mm | |
| Min. Width/Space(out layer) | 65/65um 50/50um | 50/50um 40/40um | |
| Rigid&Flex | Structure | Book, Air-gap, Fly-tail, Unsymmetrical, Semi-flex | |
| Flex Layer Count max. | Max Layer count( any layer)12L | Max Layer count( any layer)14L | |
| Impedance Tolerance | +/-10% | +/-8% | |
| Flex Core Thk (Exclude copper) (um) | 20 | 12.5 | |
| Flex outline to Pattern tolerance(mm) | +/-0.1 | +/-0.05 | |
| Finished BD thk (mm) | 0.075 ~0.25 | 0.075 ~0.25 | |
| Raw material | DupontAP, AK, Panasonic RF-777, ITEQ IF, LCP, Tk | ||
| FPC | 1L, 2L | 1L: length 5000 meters, 2: length 46 meters（2oz),OSP | 1L: length 5000meters，2L: length 46meters（2oz),OSP |
| Roadmap 2019/2020 | |||
| Products | 2019 | 2020 | |
| Mass/Sample | Mass/Sample | ||
| Backplane | Layers | 68L/120L | 68L/120L |
| Max. Size (Finish Size) | 1250mmX570mm/1320mmX570mm | 1250mmX570mm/1320mmX570mm | |
| Max. Board Thickness | 10mm/14mm | 10mm/14mm | |
| Aspect Ratio (Finish Holes 0.31mm) | 25/32 | 25/35 | |
| Aspect Ratio (Finish Holes 0.36mm) | 27/33 | 27/33 | |
| Line-Card | Layers | 32L/36L | 36L/36L |
| Min. Width/Space(out layer) | 3mil/3mil 2.5mil/2.5mil | 3mil/3mil 2.5mil/2.5mil | |
| Min. Width/Space(inner layer) | 2.2mil/2.2mil 2mil/2mil | 2.2mil/2.2mil 2mil/2mil | |
| Aspect Ratio (Finish Holes 0.20mm) | 20/25 | 22/25 | |
| Aspect Ratio (Finish Holes 0.25mm) | 21/27 | 24/27 | |
| Impedance Tolerance | ±7%/±5% | ±5%/±5% | |
Copyright ©️ 2018 ShenZhen LvMei JinYu Electronics Co., Ltd
Some of the material comes from the Internet. If there is any infringement, please contact us!