| Manufacturing capacity | |
| Material | 1. 96% alumina ceramic 2. 99% aluminum nitride ceramic 3. sapphire 4. borosilicate glass |
| Conductor process | 1.DPC (direct copper plating) 0.1~10 ounces 2.LAM (laser with copper) 0.1~10 ounces |
| Performance | 1. Copper bonding force (N/cm2): ≥ 20 2. Thermal conductivity (W/m.K): 96% alumina ceramic 20~27 W/m.K Aluminum nitride ceramic 180~220 W/m.K Sapphire 27~30 W/m.K borosilicate glass 2 ~ 5 W/m.K Warpage (mm): ≤ 2% |
| Substrate material | Common large material size/mm：120*120 127*127 132*132 140*130 190*140 |
| Common bulk thickness/mm: 0.254 0.381 0.5 0.635 0.8 1.0 1.2 1.5 2.0 | |
| 1.2, 1.5, 2.0 needs to be customized in advance, customized time 20 days | |
| Drilling | Minimum aperture: 0.075mm |
| Aperture taper tolerance: +/-10%; | |
| Drilling offset: +/- 0.02mm | |
| Slot tolerance: Length ≥ 2 times width: +/- 0.05mm on the long side, +/- 0.025mm on the wide side; Length < 2 times width: long side +/- 0.025mm, wide side +/- 0.010mm; | |
| Plating | Single side / Double side Copper thickness (ounces) H/H 1/1 2/2 3/3 4/4 5/5 6/6 7/7 8/8 9/9 10/10 Through hole plating is perfect for sealing，No hole marks are found on the surface of the via hole. Electroplated copper surface roughness: ≤0.3UM. |
| Line | Line alignment tolerance: ± 0.045mm; Minimum line width: 0.1/0.1mm; |
| Solder mask | 1. Unspecified ink thickness is controlled as follows (customer specified ink thickness is controlled according to customer requirements) 1 line surface: ≥10um; 2 line angle: ≥ 8um; 3 substrate: ≥ 15um; 2. Coaming ink thickness: 70~120 um; 3. Soldering resistance alignment tolerance: ±0.045mm; 4. The minimum width of the solder mask line: ① Surface copper 1OZ minimum width: 0.075mm; ②Surface copper 2OZ minimum width: 0.10mm; ③Surface copper 3OZ minimum width: 0.15mm; ④Surface copper 4OZ minimum width: 0.175mm; 5. Solder mask film minimum window opening: minimum line width: 0.15mm |
| Remarks: The ink adopts sulfur-free and halogen-free ink with excellent high temperature resistance and high reflectivity, and can withstand the eutectic welding process without falling off and discoloration. | |
| Silk Screen | The minimum character line width is ≥0.15mm; Character alignment tolerance ≥0.15mm; The minimum character diameter is ≥0.75mm; The minimum character gap is ≥0.15mm; |
| Surface Treatment | 1.ENIG: No special requirements from customers Gold thickness: 0.025 ~ 0.075um， Nickel thickness: 4 ~ 8um; if required by customers, it is controlled as required. 2.Immersion Ag：Ag thickness: 0.2 ~ 0.5um. 3.Immersion Tin：Tin thickness is 0.5-1.5um according to normal requirements. 4.OSP：The film thickness is 0.2-0.5 um according to the conventional requirements. |
| Laser profile | 1. The closest distance of the cutting line to the line: 0.2mm; (coating the protective layer and laser marking, single-sided lines can be lined from the back) 2、Alignment of upper and lower cutting lines: ±0.02mm; (double-sided stencil control alignment) 3.The thickness of the residual thickness is ±0.05mm; the depth of the scribe plate is 1/2 of the thickness of the whole plate. The depth of the peripheral sub-board line is 2/3 of the thickness of the whole board; and it is subject to easy breakage. 4.Offset accuracy tolerance: ±0.025mm; 5.Distance tolerance from cutting line to cutting line: ±0.025mm; 6.Shape tolerance +/-0.1mm; 7.Laser cutting line width 0.1mm |
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